Some electronics trivia. Looks lie my long term memory is still woking.
A major reliability issue is moisture. Through the 80s high reliability chi[s were packaged in expensive hermetic ceramic packages, sealed in a dry nitrogen environment. Cheaper plastic packages did not keep moisture out. The solution was called passivization, coating the chip in a glass layer.
Device and method for forming a device are presented. A substrate having circuit component and a back-end-of-line (BEOL) dielectric layer with interconnects is provided. A pad dielectric layer is formed over the BEOL dielectric layer. The pad dielectric layer includes a pad via opening which...
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An old chip reliability issue found in the 70s or 80s was called purple plague because it looked purple. It was fond dung long erm rel9ability tests.
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Abstract
urple plague is shown to be the development of a purple intermetallic compound AuAl 2 when gold wires are bonded to aluminum metallization regions in silicon transistors and integrated circuits. It is further shown that the rate of formation of purple plague is catalyzed by the presence and interaction of silicon, and that the catalyzed product is harmful to the device. Part of the ternary system is investigated to elucidate the mechanism of the ternary interaction. Various metallization-wire systems are reviewed which are currently in use or development. The use of aluminum wire to aluminum metallization is shown to be the simplest, most reliable method presently available for eliminating purple plague.
A long term reliability issue is micro cracks. The dimensions are very small. Like any mechanical part long term vibrations and thermal cycling can increase the fr acre to a point of failure.
Then there are impurities in the chip. With temperature impurities can actually move around with temperature.
That leads to the Arrhenius Equation. Each defect in a sold state device has an activation energy number assigned to it. The equation predicts a failure at higher temperatures
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Another long term failure mode is the mechanical stress created by electric charges on very thin structures. A number I remember from the 80s is 300 years, estimated of course.
In the 80s reliability of plastic of commercial packaged chips became as good as high reliability parts. Don't know about today, high rel categories were replaced by industrial and automotive grade parts.
It is mostly temperature. Chips are screened at elevated premature and ones that work at higher temperature are but into the higher performance categories.
Temperature is the bane of solid state parts. Electronics reliability is generally modeled by the exponential distribution and the Weibul Distribution. The 'bath tub curve.
Human mortality used to follow a bath tub like curve. The infant mortality rate stars highand drops exponentially wiht time. Birth defects, disease. The curve generally flattens out to what is called the chance region, deaths by random events. Accidents, catching a disease. With increasing age the failure rate increases. Heart disease and so on.
In reliability the early stage fares are called infant failures. The middle range useful life. And the last stage wear out. Complex electronics ted to follow the bath tb curve.
For the mathematically inclined.
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